发明名称 |
REDUCING DIELECTRIC LOSS IN SOLDER MASKS |
摘要 |
A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons. |
申请公布号 |
WO2013085542(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
WO2011US64196 |
申请日期 |
2011.12.09 |
申请人 |
INTEL CORPORATION;MILLER, DENNIS J. |
发明人 |
MILLER, DENNIS J. |
分类号 |
H05K3/34;H01L21/60;H01L23/12;H05K1/18 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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