| 发明名称 |
METHOD AND APPARATUS FOR IMPROVING SUBSTRATE WARPAGE |
| 摘要 |
<p>A package substrate includes conductive layers and a dielectric interposed between the conductive layers. The dielectric includes a stiffening material component and a neat resin doped with a negative coefficient of thermal expansion (CTE) fiber.</p> |
| 申请公布号 |
KR20130063037(A) |
申请公布日期 |
2013.06.13 |
| 申请号 |
KR20137012327 |
申请日期 |
2011.10.13 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
BCHIR OMAR J.;SHAH MILIND P.;MOVVA SASHIDHAR |
| 分类号 |
H01L23/14;H01L23/498 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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