| 摘要 |
A resin composition is provided to ensure excellent heat resistance, thermal conductivity, reflectivity and processability such as thin film forming, and to be used for a light-emitting diode package housing. A resin composition for a light emitting diode packaging comprises a crystalline resin 30-70 weight% having a melting point of 270 ‹C or greater, inorganic material 5-50 weight%, thermoconductive filler 1-40 weight% and rigidity increaser 5-30 weight%. The crystalline resin is one or more selected from polyphenyleneamides, polyphenylenesulfides and liquid crystal polymers. |
