| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface acoustic wave (SAW) device in which a SAW element can be properly packaged on the surface of a packaging substrate. <P>SOLUTION: A manufacturing method of a SAW device 51 includes an element preparation step (Fig.4(a) to Fig.5(a)) for preparing a SAW element 1, and a substrate preparation step for preparing a packaging substrate 53 with which a connection electrode 55 is formed on a packaging surface 53a. The SAW element 1 includes a piezoelectric substrate 3, an excitation electrode 5 positioned on one face of the piezoelectric substrate 3, a cover 9 overlaying the excitation electrode 5, and an external electrode 7 electrically connected with the excitation electrode 5 and exposed to a side to which a top face 9a of the cover 9 is confronted. Further, the manufacturing method of the SAW device 51 includes a bonding step (Fig.5(c)) for bonding the external electrode 7 to the connection electrode 55 via a bump 57 while placing the top face 9a of the cover 9 on the packaging surface 53a of the packaging substrate 53. <P>COPYRIGHT: (C)2013,JPO&INPIT |
