| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition for a film capacitor mold, having good capacitor characteristics, particularly good appearance, no void-occurrence, less moisture permeability of a cured product, a small change rate in dielectric resistance, and excellent reliability. <P>SOLUTION: A resin composition for a film capacitor contains, as an essential component, (A) a liquid epoxy resin, (B) a dicyclopentadiene-type epoxy resin, (C) an acid anhydride curing agent and (D) an inorganic filler, where when the total amount of the (A) liquid epoxy resin and the (B) dicyclopentadiene-type epoxy resin is 100 pts.mass, mixing amounts of the components are as follows: the (A) liquid epoxy resin is 50 to 90 pts.mass, the (B) dicyclopentadiene-type epoxy resin is 10 to 50 pts.mass, the (C) acid anhydride curing agent is 75 to 120 pts.mass and the (D) inorganic filler is 500 to 1500 pts.mass. <P>COPYRIGHT: (C)2013,JPO&INPIT |
