发明名称 HEAT SINK
摘要 Disclosed herein is a heat sink including: a pipe for refrigerant movement including a first path, a third path having a cross-sectional area smaller than that of the first path in a thickness direction, and a second path connecting between the first and third paths and having a cross-sectional area in the thickness direction reduced from the first path toward the third path; and a case enclosing the pipe for refrigerant movement.
申请公布号 US2013146259(A1) 申请公布日期 2013.06.13
申请号 US201213402525 申请日期 2012.02.22
申请人 OH KYU HWAN;HONG CHANG SEOB;KWAK YOUNG HOON;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH KYU HWAN;HONG CHANG SEOB;KWAK YOUNG HOON
分类号 F28D15/00 主分类号 F28D15/00
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