METHOD FOR FORMING RESIN CURED FILM PATTERN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING TOUCH PANEL, AND RESIN CURED FILM

摘要

The method for forming a resin cured film pattern of the present invention comprises a first step for disposing on a substrate a photosensitive layer having a thickness of 10 µm or less formed from a photosensitive resin composition containing a binder polymer, which comprises carboxyl groups and has an acid value of 75 mg KOH/g or greater, a photopolymerizable compound, and a photopolymerization initiator, a second step for curing specific parts of the photosensitive layer by exposure to active light rays, and a third step for forming a cured film pattern of specific parts of the photosensitive layer by removing all but specific parts of the photosensitive layer, wherein the photosensitive resin composition contains as the photopolymerization initiator an oxime ester compound and/or phosphine oxide compound.