发明名称 EPOXY RESIN COMPOSITION, OPTICAL SEMICONDUCTOR DEVICE, AND MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of providing a cured material excellent in transparency, and excellent in ultraviolet resistance, heat resistance, and dimensional stability, and capable of employing different curing systems. <P>SOLUTION: The epoxy resin composition contains as essential components (A) an alicyclic epoxy resin, (B) an ester compound of an acid anhydride represented by formula (1) and a cyclic ether compound having a hydroxy group, (C) a curing agent, and (D) a catalyst, wherein the proportion of the (A) component, the alicyclic epoxy resin is 30 to 85 mass% in the total amount of the (A) component, the alicyclic epoxy resin, and the (B) component, the ester compound. In the formula, R is hydrogen or a 1-5C hydrocarbon group. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013116986(A) 申请公布日期 2013.06.13
申请号 JP20110265618 申请日期 2011.12.05
申请人 KYOCERA CHEMICAL CORP 发明人 TAKAHASHI YUKO;OKAMOTO MASANORI
分类号 C08G59/24;C08G59/40;C08G59/70;H01L23/29;H01L23/31 主分类号 C08G59/24
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