发明名称 NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR
摘要 The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.
申请公布号 US2013149506(A1) 申请公布日期 2013.06.13
申请号 US201313759645 申请日期 2013.02.05
申请人 AKTIENGESELLSCHAFT AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK;AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT 发明人 WEIDINGER GERALD;WEICHSLBERGER GUNTHER;LEITGEB MARKUS;STAHR JOHANNES
分类号 C08L91/06 主分类号 C08L91/06
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