发明名称 APPARATUS FOR PROBING DIE ELECTRICITY AND METHOD FOR FORMING THE SAME
摘要 A method of forming an apparatus for probing die electricity, which determines a reinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate.
申请公布号 US2013147507(A1) 申请公布日期 2013.06.13
申请号 US201213706526 申请日期 2012.12.06
申请人 MJC PROBE INC.;MJC PROBE INC. 发明人 LEE CHUNG-TSE;WU CHIEN-CHOU;CHAN YI-MING
分类号 G01R1/04 主分类号 G01R1/04
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