发明名称 SUBSTRATE HOUSING CONTAINER
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate housing container which prevents the damage of a thin film wafer in a bonded substrate and avoids particle contamination. <P>SOLUTION: A substrate housing container 10 includes: a container body 11 housing a bonded substrate 5 where a thin film wafer 1 is bonded to a support substrate 3; a lid 13 disposed at an opening 12 of the container body 11 so as to open and close the opening 12 and sealing the container body 11; multiple substrate support pieces 15 disposed on an inner wall surface of the container body 11; substrate support members 16 which are respectively provided at an inner side surface of the lid 13 and an inner wall surface of the container body 11 which faces the inner side surface and contact outer peripheral end surfaces of the multiple bonded substrates 5 carried in the container body 11 and placed on the substrate support pieces 15 to support the outer peripheral end surfaces, the substrate support members 16, each of which is formed by an elastic member intersecting with a major surface of the bonded substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013118211(A) 申请公布日期 2013.06.13
申请号 JP20110263661 申请日期 2011.12.01
申请人 TOKYO ELECTRON LTD 发明人 SUGITA KIPPEI;FUJIWARA KAORU
分类号 H01L21/673;B65D85/86 主分类号 H01L21/673
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