| 摘要 |
PURPOSE: A panel bonding device is provided to prevent drooping of a circuit wire, thereby increasing bonding quality. CONSTITUTION: A lower mount stage(320) is installed on an upper surface of a lower stage(310). A plurality of lower bonding chucks(330) are installed on the lower mount stage. A connection rod(370) is installed on the inner side of an align stage. Four ling holes(360a) are formed on the align stage. A circuit board positioning unit(390) is formed on a side of the lower stage. |
