| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package device which shortens a path length of a ground current between substrates and achieves excellent high frequency performance. <P>SOLUTION: A package device according to one embodiment comprises: a first ground conductor layer where a first ground pattern is formed; a first substrate disposed on an upper surface of the first ground conductor layer and where a first line pattern is formed; a second ground conductor layer disposed on the upper surface of the first ground conductor layer and where a second ground pattern is formed; a second substrate disposed on an upper surface of the second ground conductor layer and where a second line pattern is formed; and a first bonding wire connecting the first line pattern with the second line pattern. An inclination is formed at a connection part on the upper surface of the first ground conductor layer, the connection part connecting with the second ground conductor layer. An inclination is formed at a connection part on a bottom surface of the second ground conductor layer, the connection part connecting with the first ground conductor layer, so as to fit in the inclination of the connection part on the upper surface of the first ground conductor layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
