| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of cleaning a wafer that eliminates the need to set a cleaning time excessively long even for a wafer having sticking matter concentrated at an outer peripheral part, and improves productivity as compared with before. <P>SOLUTION: There is provided the method of cleaning the wafer which has the outer peripheral part to be processed and also has sticking matter at the outer peripheral part, the method including a holding step of holding the wafer on a holding table having a holding surface for holding the wafer and a rotary shaft orthogonal to the holding surface, and a cleaning step of cleaning the wafer by moving a cleaning liquid jet port between the center of the wafer and the outer peripheral part while jetting the cleaning liquid from the cleaning liquid jet port opposed to the wafer held on the holding table rotating on the rotary shaft after the holding step. In the cleaning step, the cleaning liquid jet port is moved at a first speed up to a first point at a predetermined distance away from the center of the wafer in an outer peripheral direction, and then moved from the first point to the outer periphery of the wafer at a second speed slower than the first speed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
