CIRCUIT MEMBER, METHOD OF MANUFACTURING CIRCUIT MEMBER, SEMICONDUCTOR DEVICE, AND SURFACE LAMINATION STRUCTURE OF CIRCUIT MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a circuit member capable of enhancing the adhesion strength with a sealing resin.

SOLUTION: In a circuit member, a frame material having a die pad part 3 mounting a semiconductor chip 11 on its upper surface, and a lead part 8 electrically connected with the semiconductor chip 11, is formed by pattern processing of a rolled copper plate or a rolled copper alloy plate. The upper surface of the die pad part 3, and a part in an upper surface of the lead part 8 to which a bonding wire 13 is connected, are smooth surfaces. Plating layers 10B are laminated on these smooth surfaces. Rough surfaces are formed in regions other than the regions where the plating layers 10B are formed and lower surfaces of the die pad part 3 and the lead part 8.

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