WIRELESS MODULE

摘要

A wireless module, in which a first substrate (11) and a second substrate (12) are stacked, is provided with connecting members (18) that are connected to the first substrate (11) and/or the second substrate (12), and form a space between the first substrate (11) and the second substrate (12) in which a mounting component including a semiconductor element (14) can be mounted. The positioning of the connecting members (18) is performed in a manner such that the plurality of connecting members (18a, 18b) are positioned uniformly in the planar-surface direction of the substrates of the wireless module.