发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition and a molded article that have excellent stability of surface appearance and impact resistance characteristics and less defective molding due to molding condition change. <P>SOLUTION: The polyamide resin composition includes (A) 100 pts.mass of a polyamide which comprises (a) a unit composed of adipic acid and hexamethylenediamine and (b) a unit composed of isophthalic acid and hexamethylenediamine and in which the isophthalic acid component ratio (x) in the total carboxylic acid component is 0.05&le;(x)&le;0.5, (Y) represented by formula (1):-0.3&le;(Y)&le;0.8 and (Y)=[(EG)-(x)]/[1-(x)], (wherein (EG) is the ratio of isophthalic acid terminal groups in the total carboxy terminal groups contained in (A) the polyamide and shown by formula (2): (EG)= isophthalic acid terminal group amount/total carboxy terminal group amount) and (B) 1-200 pts.mass of a specific inorganic filler. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013116967(A) 申请公布日期 2013.06.13
申请号 JP20110264771 申请日期 2011.12.02
申请人 ASAHI KASEI CHEMICALS CORP 发明人 SASAKI YUKIYOSHI;KURIHARA TETSUO
分类号 C08L77/06;C08K3/00 主分类号 C08L77/06
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