| 摘要 |
A method, semiconductor device, and integrated circuit with a high-k/metal gate without high-k direct contact with STI. A high-k dielectric and a pad film are deposited directly onto a semiconductor substrate. Shallow trench isolation is performed, with shallow trenches etched directly into the pad film, the high-k material, and the substrate. The shallow trench is lined with an oxygen diffusion barrier and is subsequently filled with an insulating dielectric material. Thereafter the pad film and the insulating dielectric are recessed to a point where the oxygen diffusion barrier still remains between the insulating dielectric and the high-k material, preventing any contact there between. Afterwards a conductive gate is formed overlying the device.
|
