EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME
摘要
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
申请公布号
WO2013009113(A3)
申请公布日期
2013.06.13
申请号
WO2012KR05546
申请日期
2012.07.12
申请人
LG INNOTEK CO., LTD.;MOON, SUNG BAE;KIM, HAE YEON;PARK, JAE MAN;YOON, JONG HEUM;CHO, IN HEE
发明人
MOON, SUNG BAE;KIM, HAE YEON;PARK, JAE MAN;YOON, JONG HEUM;CHO, IN HEE