| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a translucent member can be distorted by receiving stress due to variation in environment such as temperature and humidity in a solid-state imaging device. <P>SOLUTION: A solid-state imaging device includes: a printed circuit board having a first surface and a second surface that are opposite surfaces to each other; a semiconductor chip for imaging disposed on the first surface of the printed circuit board; a sealing resin disposed so as to cover the printed circuit board and the semiconductor chip; and a translucent member disposed on the sealing resin. The solid-state imaging device includes a first region located closer to an inner side than to an outer edge of the semiconductor chip and a second region located closer to an outer side than to the outer edge. The printed circuit board has first terminals, on the first surface, electrically connected to the semiconductor chip and has second terminals, on the second surface, electrically connected to the first terminals inside the printed circuit board. The second terminals are disposed only in the first region of the first region and the second region on the second surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
