发明名称 BASE MATERIAL FOR CONDUCTIVE PATTERN FORMATION, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To adapt to large item small scale production of a circuit board, and to efficiently draw a straight line in a conductive pattern to a predetermined size in a width direction. <P>SOLUTION: A base material 10 for conductive pattern formation for obtaining a circuit board includes a base 12 and a holding region 14 formed on one end face of the base 12 and showing suitable wettability to a fluid for obtaining a conductive pattern to hold the fluid. The holding region 14 is formed in an octagonal lattice shape of first to fourth straight line groups 18, 22, 28, and 30 consisting of a plurality of first to fourth straight lines 16, 20, 24, and 26. Namely, the first straight line group 18 and the second straight line group 22 form a square lattice shape, and the third straight line group 28 and the fourth straight line group 30 are positioned at diagonals of the square lattice shape. The fluid is printed at an arbitrary part of the holding region which is thus formed in a shape corresponding to the shape of a conductive pattern to be obtained. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013118362(A) 申请公布日期 2013.06.13
申请号 JP20120237384 申请日期 2012.10.29
申请人 FUJIFILM CORP 发明人 TATSUTA TAKEICHI
分类号 H05K3/38;H05K3/06;H05K3/10;H05K3/18 主分类号 H05K3/38
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