发明名称 LIGHT EMITTING DIODE AND FLIP-CHIP LIGHT EMITTING DIODE PACKAGE
摘要 A light emitting diode including a first doped layer, a light emitting layer, a second doped layer and a substrate is provided. A plurality of first grooves penetrate through the second doped layer and the light emitting layer. Thus, a partial surface of the first doped layer is exposed. At least one of the plurality of first grooves extends to edges of the second dope layer and the light emitting layer. An insulating layer is disposed over a part of second doped layer and extends to sidewalls of the first grooves. A first contact is set in the first grooves and electrically connected to the first doped layer. A second contact is set on the second doped layer and electrically connected to the second doped layer. By the first grooves, the first contact can be electrically connected to the first doped layer for improving current spreading.
申请公布号 US2013146915(A1) 申请公布日期 2013.06.13
申请号 US201213687120 申请日期 2012.11.28
申请人 GENESIS PHOTONICS INC.;GENESIS PHOTONICS INC. 发明人 HUANG YI-RU;WU CHIH-LING;LO YU-YUN;SU PO-JEN
分类号 H01L33/60;H01L33/62 主分类号 H01L33/60
代理机构 代理人
主权项
地址