发明名称 |
Landing Areas of Bonding Structures |
摘要 |
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The metal trace includes a portion having an edge, wherein the edge is not parallel to the lengthwise direction of the metal trace. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface and the edge of the portion of the metal trace. |
申请公布号 |
US2013147030(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
US201113313333 |
申请日期 |
2011.12.07 |
申请人 |
CHANG CHIH-HORNG;KUO TIN-HAO;CHEN CHEN-SHIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHANG CHIH-HORNG;KUO TIN-HAO;CHEN CHEN-SHIEN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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