| 摘要 |
<p>Nickel conductors are formed on an insulating support by deposition from a solution of the nickel cation-hypophosphite anion type. In the formation of a wiring circuit, a panel of synthetic resin bonded paper or fibreglass is pierced where the components are to be connected to the conductors; roughened as by shot-blasting, covered at those places where the circuit is not required either by applying a photosensitive material all over, exposing the material to ultra-violet light through a negative of the circuit and then removing the unexposed material, or by printing with oil-bound paint or silk-screen ink; treated with stannous chloride solution and then with palladium chloride solution to deposit a thin film of palladium; immersed in a solution containing sodium hypophosphite together with either nickel chloride and sodium citrate or nickel acetate and sodium lactate, to deposit the nickel circuit pattern; and the material covering the remainder of the panel removed. The nickel pattern may be thickened by re-immersion in the coating solution. If desired, an initial coating of adhesive may be applied to the panel: roughening may not then be necessary. According to the Provisional Specification, a copper circuit may be formed by depositing nickel on an insulating support, applying a negative pattern of the circuit to the nickel either photographically or by printing, electrodepositing copper on the exposed nickel, and removing the resist material and the nickel covered thereby.</p> |
