BACKPLANE REINFORCEMENT AND INTERCONNECTS FOR SOLAR CELLS
摘要
<p>Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.</p>
申请公布号
EP2601687(A2)
申请公布日期
2013.06.12
申请号
EP20110871380
申请日期
2011.08.05
申请人
SOLEXEL, INC.
发明人
MOSLEHI, MEHRDAD, M.;WANG, DAVID, XUAN-QI;KRAMER, KARL-JOSEF;SEUTTER, SEAN;TOR, SAM, TONE;CALCATERRA, ANTHONY