<p>PURPOSE: An electrode connection structure is provided to reduce thickness by integrating an upper electrode with a lower electrode. CONSTITUTION: A lower device(101) has a lower electrode structure(151A). The lower electrode structure includes a lower electrode barrier layer(131A) and a lower metal electrode(141A). An upper part device(102) has an upper electrode structure(152A). The upper electrode structure includes an upper electrode barrier layer(132A) and an upper metal electrode(142A). The lower is electrically connected to the upper device by the electrode structure(150A).</p>
申请公布号
KR20130062033(A)
申请公布日期
2013.06.12
申请号
KR20110128430
申请日期
2011.12.02
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, KUN SANG;PARK, BYUNG LYUL;CHOI, GIL HEYUN;BANG, SUK CHUL;MOON, KWANG JIN;LIM, DONG CHAN;LEE, DO SUN;KIM, SU KYOUNG