发明名称 Sealed crimp connection methods
摘要 <p>Methods of making a sealed crimp connection attaching a terminal (22) to a wire conductor (10) are provided. A layer of fluid conformal coating (40) is applied to overlie a terminal (22) and underlie at least a lead (18) of the wire conductor (10) upon at least the lead (18) being received into the terminal (22). The terminal (22), the fluid layer, and at least the lead (18) of the wire conductor (10) are crimped to form the crimp connection. Fluid conformal coating (40) is displaced where an abutting surface (36) of the terminal (22) makes contact with at least the lead (18) of the wire conductor (10). The fluid conformal coating (40) is cured to a non-fluid state. The fluid conformal coating (40) may be formed of an acrylated urethane material that may provide an increased pull force and a low crimp resistance in the crimp connection. The crimp connection may be constructed using a manufacturing process on an automated assembly line.</p>
申请公布号 EP2432078(A3) 申请公布日期 2013.06.12
申请号 EP20110181249 申请日期 2011.09.14
申请人 DELPHI TECHNOLOGIES, INC. 发明人 MARTAUZ, FRANCIS D.;SEIFERT, KURT P.
分类号 H01R4/70;H01R4/18;H01R4/62;H01R13/52;H01R43/048 主分类号 H01R4/70
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