| 摘要 |
The present invention relates to a process for fabricating printed circuit boards, which comprises the steps consisting in providing a printed circuit (10, 20, 30) and at least one component (50) and mechanically fastening the component (50) to the printed circuit (10, 20, 30) by bonding, characterized in that the mechanical fastening step consists in: delivering a spot of solid adhesive (60); providing, on the printed circuit, a means (100) for the temporary retention of said spot of solid adhesive (60) adjacent to the location of the component (50) to be mechanically fastened by bonding; positioning the spot of solid adhesive (60) on the temporary retention means (100); and melting and curing, for example by crosslinking, the spot of solid adhesive (60) in contact with the printed circuit (10) and with the component (50) in order for the component (50) to be mechanically fastened to the printed circuit (10) in a step of soldering the component (50), without any manual operation and with conventional equipment available on a printed circuit fabrication line. |
