INLINE CURE OVEN FOR MANUFACTURING LED PACKAGE

摘要

PURPOSE: An inline cure oven for manufacturing an LED package is provided to improve the quality of the LED package by drying a chip at uniform temperature. CONSTITUTION: A base(10) consists of frames and panels. A magazine(20) is installed in the upper part of the base. The magazine is divided into stages. The magazine has independent temperature control regions. A belt conveyor(30) successively supplies chips to the inner part of magazine.