发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative radiation-sensitive composition suitable for forming a cured pattern that constitutes an interlayer insulating film low in dielectric constant, and to provide a method for forming a cured pattern using the composition, and a cured pattern obtained by the method for forming a cured pattern. <P>SOLUTION: The negative radiation-sensitive composition contains: [A] a polysiloxane having a silanol group; [B] a polymer having a structural unit expressed by general formula (1) and having a weight average molecular weight of 1,000 to 100,000; and [C] a solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5206476(B2) 申请公布日期 2013.06.12
申请号 JP20090037115 申请日期 2009.02.19
申请人 发明人
分类号 G03F7/004;G03F7/075 主分类号 G03F7/004
代理机构 代理人
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