发明名称 |
Post-CMP wafer cleaning apparatus |
摘要 |
A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.
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申请公布号 |
US8458842(B2) |
申请公布日期 |
2013.06.11 |
申请号 |
US201113104964 |
申请日期 |
2011.05.10 |
申请人 |
LIU LI-CHUNG;CHEN YI-NAN;LIU HSIEN-WEN;NANYA TECHNOLOGY CORP. |
发明人 |
LIU LI-CHUNG;CHEN YI-NAN;LIU HSIEN-WEN |
分类号 |
B08B3/02 |
主分类号 |
B08B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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