LEADFRAME

摘要

PURPOSE: A lead frame is provided to prevent delamination by increasing adhesion with a molding epoxy in an assembly process. CONSTITUTION: An insulation groove is formed in the lower surface of a metal substrate. The metal substrate has a die pad part(101) and a lead part(102). A first lead is partly plated on the upper surface of the lead part. A second lead is plated on the lower surface of the lead part. An insulation part(130) fills the insulation groove.