发明名称 Apparatus and method for controllably implanting workpieces
摘要 A plasma processing apparatus comprises a plasma source configured to produce a plasma in a plasma chamber, such that the plasma contains ions for implantation into a workpiece. The apparatus also includes a focusing plate arrangement having an aperture arrangement configured to modify a shape of a plasma sheath of the plasma proximate the focusing plate such that ions exiting an aperture of the aperture arrangement define focused ions. The apparatus further includes a processing chamber containing a workpiece spaced from the focusing plate such that a stationary implant region of the focused ions at the workpiece is substantially narrower that the aperture. The apparatus is configured to create a plurality of patterned areas in the workpiece by scanning the workpiece during ion implantation.
申请公布号 US8461030(B2) 申请公布日期 2013.06.11
申请号 US20100947078 申请日期 2010.11.16
申请人 RENAU ANTHONY;GODET LUDOVIC;MILLER TIMOTHY J.;OLSON JOSEPH C.;SINGH VIKRAM;BUONODONO JAMES;RAMAPPA DEEPAK A.;LOW RUSSELL J.;GUPTA ATUL;DANIELS KEVIN M.;VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 RENAU ANTHONY;GODET LUDOVIC;MILLER TIMOTHY J.;OLSON JOSEPH C.;SINGH VIKRAM;BUONODONO JAMES;RAMAPPA DEEPAK A.;LOW RUSSELL J.;GUPTA ATUL;DANIELS KEVIN M.
分类号 H01L21/26;H01L21/42 主分类号 H01L21/26
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