发明名称 |
System and method for improved automated semiconductor wafer manufacturing |
摘要 |
System and method for automated semiconductor manufacturing is provided. In accordance with one aspect of the present invention, a system for automated semiconductor wafer manufacturing includes a smart overlay control (SOC) database having empirical alignment data related to overlay alignment, and a simulation module communicatively coupled to the SOC database, the simulation module determining a simulated overlay alignment of a wafer on the plurality of photolithography tools in a tool bank based on the empirical alignment data stored in the SOC database. The system also includes a dispatch module communicatively coupled to the SOC database and the simulation module, the dispatch module controlling the dispatch of a wafer to one of a plurality of photolithography tools in a tool bank based at least in part on the simulated overlay alignment.
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申请公布号 |
US8463419(B2) |
申请公布日期 |
2013.06.11 |
申请号 |
US20090617380 |
申请日期 |
2009.11.12 |
申请人 |
HSIEH WEN-YAO;CHIU CHE-YU;PENG ANWEI;CHEN JIAN-HUNG;WU HSUEH-CHEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HSIEH WEN-YAO;CHIU CHE-YU;PENG ANWEI;CHEN JIAN-HUNG;WU HSUEH-CHEN |
分类号 |
G06F19/00 |
主分类号 |
G06F19/00 |
代理机构 |
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