| 发明名称 |
Method for encapsulating an electronic arrangement |
| 摘要 |
Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.
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| 申请公布号 |
US8460969(B2) |
申请公布日期 |
2013.06.11 |
| 申请号 |
US20090996716 |
申请日期 |
2009.11.18 |
| 申请人 |
KRAWINKEL THORSTEN;KEITE-TELGENBUESCHER KLAUS;ELLINGER JAN;STEEN ALEXANDER;TESA SE |
发明人 |
KRAWINKEL THORSTEN;KEITE-TELGENBUESCHER KLAUS;ELLINGER JAN;STEEN ALEXANDER |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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