THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

摘要

PURPOSE: A thermoelectric cooling package and a thermal management method thereof are provided to secure fast cooling speed by using a thermoelectric cooling element. CONSTITUTION: The temperature of a thermoelectric cooling package is measured. A semiconductor chip and a thermoelectric cooling element(10) are included in the thermoelectric cooling package. The temperature of the thermoelectric cooling package is compared with the temperature of a target. The thermoelectric cooling element is operated if package temperature is higher than target temperature. The thermoelectric cooling element is not operated if the package temperature is lower than the target temperature.