发明名称 Semiconductor device and method for manufacturing the same
摘要 An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.
申请公布号 US8461013(B2) 申请公布日期 2013.06.11
申请号 US20100776870 申请日期 2010.05.10
申请人 MAEKAWA SHINJI;FUJII GEN;MARUYAMA JUNYA;TAKAYAMA TORU;FUKUMOTO YUMIKO;ARAI YASUYUKI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MAEKAWA SHINJI;FUJII GEN;MARUYAMA JUNYA;TAKAYAMA TORU;FUKUMOTO YUMIKO;ARAI YASUYUKI
分类号 H01L21/76;G06K19/077;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L27/13;H01L29/786 主分类号 H01L21/76
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