| 摘要 |
FIELD: process engineering.SUBSTANCE: invention relates to grinding of polycrystalline diamond plates and may be used in production of components for microelectronics, IR-, visible- and X-ray-band optics. Polycrystalline diamond plate surface is subjected to abrasion-free grinding by friction between said surface and rotary rider. The latter is made from ceramics or quartz that don't react with said surface in grinding. Additionally, used is ultrafine copper or copper oxide powder as a diamond thermochemical processing initiator. Processing is carried out in air or atmosphere bearing, at least, 10% of oxygen at temperature not higher than 400°C.EFFECT: higher quality of processing, lower costs.2 cl, 1 dwg |
