| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrodeposition superabrasive tool that can securely measure a plating thickness. <P>SOLUTION: A CMP conditioner 1 includes a base metal 10 and a superabrasive layer 20 formed on a surface of the base metal 10 while the superabrasive layer 20 has diamond abrasives 22 fixed to the base metal 10 with a nickel plating layer 21, and includes a plating thickness measurement part 30 provided on the surface of the base metal 10 to measure a plating thickness of the superabrasive layer 20. The plating thickness measurement part 30 is composed of only the nickel plating layer 31. The plating thickness measurement part 30 is provided apart from the superabrasive layer 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
