发明名称 ELECTRONIC COMPONENT ATTACHMENT METHOD AND ELECTRONIC COMPONENT ATTACHMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component attachment apparatus which inhibits an electronic component taken out from a tray from being incorrectly attached to a circuit board as much as possible. <P>SOLUTION: When a production model of a printed circuit board P is changed, images of characters provided on a surface of an electronic component, which is used in the changed production module and is housed in a component housing part 41 placed in a tray 13, are captured by a board recognition camera 4 and recognized. The recognized image is compared to an image of data stored in advance. Whether or not the electronic component is correct is determined on the basis of the comparison result. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013115337(A) 申请公布日期 2013.06.10
申请号 JP20110262138 申请日期 2011.11.30
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 URAKAWA AKIHIRO;YOSHII TAKASHI;ONO TETSUJI;KIM HONG NAM
分类号 H05K13/08;H05K13/04 主分类号 H05K13/08
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