SOLDER POSITION ANALYSIS DEVICE, SUBSTRATE APPEARANCE INSPECTION DEVICE, SOLDER POSITION ANALYSIS METHOD AND SOLDER POSITION ANALYSIS PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a technology of acquiring a position on a substrate of a solder to which a terminal of a component is not to be connected.

SOLUTION: A solder position analysis method comprises: acquiring printing positions of a solder on a substrate; acquiring a connection position that is a position on the substrate of a solder to which a terminal of a component is to be connected; and acquiring a position excluding the connection position from the printing positions as a non-connection position that is a position on the substrate of a solder to which the terminal of the component is not to be connected.

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