发明名称 |
CONDUCTIVE INK COMPOSITION AND METHOD OF PRODUCING CONDUCTIVE PATTERN |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive ink composition capable of forming optional conductive patterns on various kinds of polymer film substrates or polymer film substrates coated with ceramics such as indium tin oxide without any constraint of shrinkage or deformation due to heat, and exhibiting excellent adhesion to the substrates; a conductive pattern obtained by applying the conductive ink composition on a substrate and then thermally curing it; and a method of producing the conductive pattern using the conductive ink composition. <P>SOLUTION: The conductive ink composition includes: conductive fine particles (A) which are each coated with a protective layer containing an amine compound with a boiling point ≤100°C at normal pressure and have an average particle diameter of 1-100 nm; a binder resin (B) containing a compound (b-1) having thermosetting properties and a curing agent (b-2); and a solvent (C). A content of the binder resin (B) is ≤5 pts.wt. relative to 100 pts.wt. of the conductive fine particles (A). <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013112807(A) |
申请公布日期 |
2013.06.10 |
申请号 |
JP20110263195 |
申请日期 |
2011.12.01 |
申请人 |
DAISO CO LTD |
发明人 |
KAWAMURA KENSUKE;UMAGOE HIDEAKI |
分类号 |
C09D11/00;C09D11/52;H01B1/22;H01B5/14;H01B13/00 |
主分类号 |
C09D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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