| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which can successfully actuate a semiconductor integrated circuit element by sufficiently supplying power to the semiconductor integrated circuit element. <P>SOLUTION: A wiring board comprises: through holes 5P for power positioned under each row of via connection parts 3V on a power plane 3P in a build-up wiring layer 3 on an upper surface side, in which the via connection parts 3V in each row on the power plane 3P and the through holes 5P for power under the via connection parts 3V are electrically connected through vias 6 connected to the via connection parts 3V in each row; and conductive paths formed from each row of semiconductor element connection pads 7P for power to the through holes 5P for power so as to pass through areas of the power plane 3P created by the reduction. Each of via lands 3L in a build-up wiring layer 3 on a lower surface side includes portions corresponding to a grouped plurality of vias 6, and the portions are contiguous. <P>COPYRIGHT: (C)2013,JPO&INPIT |
