| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus which accurately and promptly peels a chip work-piece disposed on an adhesive sheet without causing the damage and transports the chip work-piece to a next process. <P>SOLUTION: An apparatus for peeling an LED chip or an LD chip from an adhesive sheet and transporting the chip sticks up the LED chip or the LD chip, which is disposed on an adhesive layer on the surface side of the adhesive sheet, from the rear surface side of the adhesive sheet using a tool to peel the chip and then picks up and transports the chip to a next process. The tool is a horn member having an upper end formed into a conical shape and vibrations may be provided from an ultrasonic vibrator disposed below the horn member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
