| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a decrease in yield of processing on a sample such as a semiconductor wafer. <P>SOLUTION: The vacuum processing apparatus includes: a row of containers in a vacuum conveyance chamber which are mutually coupled and reduced in pressure behind a lock chamber and in which a wafer is conveyed; intermediate chambers which are each disposed between the containers in the vacuum conveyance chamber and in which the wafer is mounted and stored; a plurality of processing units which are each coupled to a side wall on one of right and left sides of each of the containers in the vacuum conveyance chamber and each include a processing container in which the wafer is processed; and bypass chambers which constitute a bypass line connecting those processing units. To the plurality of containers in the vacuum conveyance chamber, only one of a wafer conveyed from the lock chamber to one of the plurality of processing units and a wafer passed through the bypass chamber after being processed by one of the plurality of processing units, processed by another processing unit, and conveyed toward the lock chamber is conveyed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
