| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a press-pack semiconductor module maintain thermal contact between a semiconductor element and a cooling member and heat dissipation performance of the cooling member even when a plurality of semiconductor elements are included. <P>SOLUTION: A semiconductor module 1 comprises: laminated members 2 in each of which a semiconductor element is sandwiched; and a pair of cooling members 3a, 3b arranged in contact with both surfaces of each laminated member 2. The cooling members 3a, 3b include refrigerant flow paths 31 formed inside, respectively, in such a manner as not to overlap contact faces 30a, 30b of the cooling members 3a, 3b with the laminated member 2. The cooling member 3a is pressed against the laminated member 2 by an energization member 16. The cooling members 3a, 3b include wall parts 32a, 32b, respectively, which do not overlap the contact faces 30a, 30b and each of which has a wall thickness thinner than a wall thickness of each of the wall parts 33a, 33b which overlap the contact faces 30a, 30b, respectively. The energization member 16 is subjected to a pressing force of a seal member 17 and pressed against a surface of the wall part 33a. A thermal isolation member 15 supported by the cooling members 3a, 3b is provided in a space between the laminated members 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
