| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer film and a package having excellent pinhole resistance. <P>SOLUTION: The multilayer film is obtained by laminating a first resin layer, a core layer and a second resin layer in this order, the first resin layer is obtained by laminating a first repeated laminated section formed of a first base resin layer and a first adhering layer in plurality, and the second resin layer is obtained by laminating a second repeated laminated section formed of a second base resin layer and a second adhering layer in plurality. Also, the package is formed of the multilayer film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
