| 发明名称 |
SEMICONDUCTOR PACKAGE MODULE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology of downsizing an installation area of a semiconductor package module. <P>SOLUTION: A semiconductor package module 1 comprises: a flat first package 210 housing a semiconductor element; a flat second package 210 housing a semiconductor element; and a case body 100 housing the first and second packages arranged such that principal surfaces of the first and second packages face each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013115322(A) |
申请公布日期 |
2013.06.10 |
| 申请号 |
JP20110261929 |
申请日期 |
2011.11.30 |
| 申请人 |
SANYO ELECTRIC CO LTD |
发明人 |
NAGAMATSU MASAYUKI;KATO YOSHIFUMI |
| 分类号 |
H01L25/10;H01L23/00;H01L23/40;H01L25/07;H01L25/18;H02M7/48 |
主分类号 |
H01L25/10 |
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