| 摘要 |
FIELD: radio engineering, communication.SUBSTANCE: subject of the present invention is an electronic board (1), having a zone (20) which forms a BGA type electronic component (10) substrate, an electrical heating resistance (25A) opposite said zone, wherein the heating resistance is capable of supplying an amount of heat to solder the component on the board. The board according to the invention has multiple electroconductive layers (21, 23, 25, ?), which alternate with electrically-insulating layers (22, 24, 26), wherein said resistance (25A) forms one of the electroconductive layers lying immediately under the surface layer (21). If needed, the board has a heat sink. The subject of the present invention is also an apparatus for applying the method, which enables to repair an electronic board by replacing faulty components without the danger of unsoldering or damaging neighbouring components.EFFECT: method enables to eliminate and compensate for heat stress arising in the board during soldering, and unsoldering of electronic components.5 cl, 6 dwg |
