发明名称 METHOD FOR SPLITTING BRITTLE MATERIAL SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To simplify a working step by forming a scribe line having a vertical crack reaching the rear surface, only by a scribing operation of a brittle material substrate without requiring a conventional breaking step. <P>SOLUTION: When performing splitting, information (the thickness, the kind or the like) on the brittle material substrate is inputted, and a scribing wheel corresponding to the information of the thickness or the like is selected and mounted on a scribe head. Scribing is performed by applying a prescribed scribe load corresponding to the thickness of the brittle material substrate, and thereby a scribe line having a vertical crack reaching the rear surface can be formed (fully cut) without requiring a conventional breaking step. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013112534(A) 申请公布日期 2013.06.10
申请号 JP20110257253 申请日期 2011.11.25
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MAEKAWA KAZUYA
分类号 C03B33/023;B28D1/24;B28D5/00;C03B33/037 主分类号 C03B33/023
代理机构 代理人
主权项
地址